Product features

1. Good dispersion.

2. Wide particle size distribution: 10nm.

3. High purity, effectively reducing contamination of electronic products

4. Suitable for polishing with various polishing pads and synthetic materials.

5. PH, particle size, stable ions, etc. can be customized according to customers.

6. Chemical mechanical polishing solution synthesized by special technology, with spherical and monodisperse nanoparticles, uniform size, narrow particle size distribution, can obtain high-quality

Polishing accuracy

During the polishing process, there are:

1. High polishing speed, utilizing large colloidal silica particles to achieve high-speed polishing.

2. High flatness processing, this product is polished using colloidal particles of SiO2, which will not cause physical damage to the workpiece, achieving high flatness processing

After the polishing process, it has:

1. The accuracy can reach the nanometer level

Scratches and cuts can reach 0/0.

Suitable for the removal and flattening of copper in the copper interconnect process in integrated circuits. With a high copper removal rate, the disc shape is called an adjustable sink

Low defect and other characteristics. Can be applied to logic chips, as well as 3D NAND and DRAM chips for mass production use. Clean the polished surface of copper in integrated circuits

Polish particles and chemical residues to prevent copper surface corrosion and reduce surface defects.

And it is used for grinding and polishing of monocrystalline silicon and polycrystalline silicon, as well as for memory processes and back illuminated sensor (BSI) processes. Customizable and stable selection

Ratio, removal rate, and selectivity ratio for oxides/nitrides. The silicon polishing liquid series has the advantage of low defects. The BSI polishing fluid series has ideal

The removal rate and selectivity ratio of silicon and silica. Covering TSV copper/barrier layer S, TSV crystal back copper/dielectric layer polishing, TSV crystal back silicon

TSV crystal backed silicon/copper, etc. It has advantages such as high removal rate and adjustable selection ratio.

And polishing of shallow groove isolation in integrated circuit manufacturing processes, etc

usage method

usage method:

1. Clean the bottle mouth before use to prevent contamination.

2. When using, deionized water can be diluted according to the needs of different industries to modulate different concentrations

3. The site should be kept clean and free of dust to prevent contamination during the preparation and use of polishing solution.

When the viscosity increases during cyclic use, a new polishing solution should be prepared to avoid damaging the workpiece and reducing yield

Storage method:

1. Keep indoor shade cool

2. Avoid prolonged exposure to air.

3. During storage, avoid exposure to sunlight and store at a temperature of 5-35C

4. Store below 0 ° C to prevent icing, and fail due to the formation of non dispersible clumps below zero ° C

Affordable price:

Introducing foreign production technology, the quality can be comparable to imported products, effectively avoiding the long delivery cycle and price of imported products

Expensive.