CY-SP30S Jiupeng specialized for nano silica resin

CY-SP30S Jiupeng specialized for nano silica resin

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CY-SP30S Jiupeng specialized for nano silica resin

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  • Parameters

Hangzhou Jiupeng New Materials


Nano silica has strong electronic and electrical properties, which can significantly improve the material's performance. After special treatment with a special epoxy resin coupling agent, the epoxy resin specific nano silica (CY-SP30S) is produced, which has better dispersibility and can greatly improve the tensile strength, impact strength, elongation at break, thermal stability and other properties of epoxy resin, while maintaining transparency


The application of nano silica in epoxy resin:


1. Heat resistance: Due to the large specific surface area of nano silica particles, their interface adhesion with the epoxy matrix is strong, absorbing a large amount of impact energy and increasing the rigidity of the matrix. Therefore, nano silica particles can enhance and toughen the epoxy resin within a certain range, while also improving the heat resistance of the material


2. Enhanced toughening effect: Due to the addition of nano silica particles, the impact strength, tensile strength, elongation at break and other properties of epoxy resin composite materials have been greatly improved within a certain range, indicating that nano silica particles have played a role in enhancing toughening. It highlights the excellent filling characteristics of nano silica, resulting in a significant improvement in material properties


Product indicators:


project


index


appearance


White powder


model


CY-SP30S


Particle size, nm


30±5


Specific surface area, m2/g


150-250


Content%


≥99.5


PH value


5-7


usage method:


Add dried and dehydrated nano silica into a solvent containing coupling agent while stirring, and then treat it with grinding, high-speed shearing, ball milling, sand milling, ultrasound, etc. for several tens of minutes. In the stirring state, mix the above solution and epoxy resin evenly, remove the solvent, and raise the temperature to 130 ℃ to allow the coupling agent to react with the epoxy resin for 1 hour. After cooling, add a stoichiometric curing agent, mix evenly, evacuate and degas, pour it into a steel mold coated with a release agent and preheated, and cool and release the film after the temperature is programmed to cure completely.


Add quantity:


The recommended addition amount is a ratio of 100:5 between the mass of epoxy resin and nano silica. Customers can also choose the appropriate addition ratio according to their actual situation.


Dispersion of nano silica:


Due to the small size and high surface activity of nanoparticles, they are prone to agglomeration and lose their intended role in enhancing and toughening polymers. Therefore, when preparing nanoparticle filled composite materials, nanoparticles should be fully dispersed. Grinding, high-speed shearing, ball milling, sand milling, ultrasound and other treatments will help to disperse nanoparticles in the resin


Due to the high surface energy and strong adsorption of nanoparticles, they are prone to aggregation and difficult to disperse uniformly and stably. Therefore, we use methods such as grinding, high-speed shearing, ball milling, sand milling, ultrasound, and coupling agent treatment to promote the uniform dispersion of nano silica in epoxy resin


According to the single-layer theory of coupling agent action, as the particle size decreases, the amount of coupling agent increases, and the mass ratio of silane coupling agent to nano silica is set at 5/100.


Packaging: 10 kg/bag


Storage method: Nano silica should be stored in a dry and enclosed environment, and should not be exposed to volatile substances.



型号
CY-SP30S